주요생산품
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주요생산품
[ Silicone Gap Pad ]
좌우로 드래그 하세요
| N O |
Product Name | Building a Part Number | Thermal Conductivity [ W/m-K ] |
Hardness | Density [ g/cc ] |
Product characteristics | ||||||||||||
| SPS | 150 | N | - | 75DM50 | [ Shore 00 ] | |||||||||||||
| ① | ② | ③ | - | ④ | 20 | 30 | 40 | 50 | 60 | 70 | 80 | 90 | ||||||
| 1 | SPS-100-Series |
① SPS : Silicon Pad Series ② Thermal Conductivity ③ Product characteristics ④ Detailed specifications EX) - 75DM50 - First number : size of the biggest particle, - second letter : type of silicon - the last number : Hardness |
1.0 | 1.1 ~ 2.5 | N | Natural tack on both surfaces of silicon pad | ||||||||||||
| 2 | SPS-200-Series | 2.0 | 1.8 ~ 2.5 | NL | Low density and natural tack on both sides of pad | |||||||||||||
| 3 | SPS-300-Series | 3.0 | 2.5 ~ 2.8 | NA | One Side - Tack treatment on single side of pad | |||||||||||||
| 4 | SPS-400-Series | 4.0 | 2.8 ~ 3.2 | NF | One Side - Transfer film processing silicon pad | |||||||||||||
| 5 | SPS-500-Series | 5.0 | 2.8 ~ 3.2 | NI | One Side - polyimide film processing silicon pad | |||||||||||||
| 6 | SPS-600-Series | 6.0 | 2.8 ~ 3.2 | NP | One Side - PET film processing silicon pad | |||||||||||||
| 7 | SPS-700-Series | 7.0 | 2.8 ~ 3.2 | NS | Use glass fiber silicon pad | |||||||||||||
| 8 | SPS-800-Series | 8.0 | 2.8 ~ 3.5 | |||||||||||||||
| 9 | SPS-1200-Series | 12.0 | 3.0 ~ 3.5 | |||||||||||||||
[ Thermal High Consistency Rubber Silicon Pad ]
좌우로 드래그 하세요
| N O |
Product Name | Building a Part Number | Thermal Conductivity [ W/m-K ] |
Hardness | Density [ g/cc ] |
Product characteristics | ||||||||||||
| THS | 160 | N | - | 25DM80 | [ Shore A ] | |||||||||||||
| ① | ② | ③ | - | ④ | 20 | 30 | 40 | 50 | 60 | 70 | 80 | 90 | ||||||
| * | SPS-160-Series |
① THS : Thermal High Consistency Rubber Silicon ② Thermal Conductivity ③ Product characteristics ④ Detailed specifications EX) - 25DM80 - First number : size of the biggest particle, - second letter : type of silicon - the last number : Hardness |
1.6 | 2.1 ~ 2.3 | N | Natural tack on both sides of silicon pad | ||||||||||||
| NL | Low density and natural tack on both sides of pad | |||||||||||||||||
| NA | One Side - Tack treatment on single side of pad | |||||||||||||||||
| NF | One Side - Transfer film processing silicon pad | |||||||||||||||||
| NI | One Side - polyimide film processing silicon pad | |||||||||||||||||
| NP | One Side - PET film processing silicon pad | |||||||||||||||||
| NS | Use glass fiber silicon pad | |||||||||||||||||
[ Silicone Gap filler ]
좌우로 드래그 하세요
| N O |
Product Name | Building a Part Number | Thermal Conductivity [ W/m-K ] |
Viscosity [ CPS ] |
Hardness | Density [ g/cc ] |
Product characteristics | ||||||||||||
| SPS | 150 | N | - | 50DM38 | [ Shore 00 / A ] | ||||||||||||||
| ① | ② | ③ | - | ④ | 20 | 30 | 40 | 50 | 60 | 70 | 80 | 90 | |||||||
| 1 | TGF-100-Series |
① TGF : SThermal Gap Fillers (2 Parts) ② Thermal Conductivity ③ Product characteristics ④ Detailed specifications EX) - 50DM38 - First number : size of the biggest particle, - second letter : type of silicon - the last number : Viscosity |
1.0 | ~ 200,000 | 1.1 ~ 2.5 | N | Natural tack on both sides of silicon pad | ||||||||||||
| 2 | TGF-200-Series | 2.0 | ~ 300,000 | 1.8 ~ 2.5 | F | Glass-beads | |||||||||||||
| 3 | TGF-300-Series | 3.0 | ~ 350,000 | 2.5 ~ 2.8 | A | Provided with adhesives | |||||||||||||
| 4 | TGF-400-Series | 4.0 | ~ 450,000 | 2.8 ~ 3.2 | |||||||||||||||
| 5 | TGF-500-Series | 5.0 | ~ 550,000 | 2.8 ~ 3.2 | |||||||||||||||
| 6 | TGF-600-Series | 6.0 | ~ 600,000 | 2.8 ~ 3.2 | |||||||||||||||
| 7 | TGF-700-Series | 7.0 | 600,000 ~ | 2.8 ~ 3.2 | |||||||||||||||
| 8 | SPS-800-Series | 8.0 | 600,000 ~ | 2.8 ~ 3.5 | |||||||||||||||
[ Silicone Thermal Grease ]
좌우로 드래그 하세요
| N O |
Product Name | Building a Part Number | Thermal Conductivity [ W/m-K ] |
Viscosity [ CPS ] |
Density [ g/cc ] |
Product characteristics | ||||
| SPS | 150 | N | - | 50DM38 | ||||||
| ① | ② | ③ | - | ④ | ||||||
| 1 | TGS-200-Series |
① TGS : Silicone Thermal Grease ② Thermal Conductivity ③ Product characteristics ④ Detailed specifications EX) - 50DM38 - First number : size of the biggest particle, - second letter : type of silicon - the last number : Viscosity |
2.0 | 250,000 | 1.8 ~ 2.5 |
· Low thermal resistance and efficient heat delivering system achieved by using micro filers · The material does not evaporate even after a long working period. · Meets the requirements of environmental conditions including RoHS. · Product with minimized oil bleeding · Product with high viscosity |
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| 3 | TGS-300-Series | 3.0 | 280,000 | 2.5 ~ 2.8 | ||||||
| 5 | TGS-400-Series | 4.0 | 300,000 | 2.8 ~ 3.2 | ||||||
| 7 | TGS-700-Series | 7.0 | 400,000 | 3.0 ~ 3.2 | ||||||
[ PCM_phase change materials ]
좌우로 드래그 하세요
| N O |
Product Name | Building a Part Number | Thermal Conductivity [ W/m-K ] |
Density [ g/cc ] |
Product characteristics | ||||
| PCM | 200 | N | - | 50AK48 | |||||
| ① | ② | ③ | - | ④ | |||||
| 1 | PCM-200-Series |
① PCM : phase change materials ② Thermal Conductivity ③ Product characteristics ④ Detailed specifications EX) - 50AK48 - First number : size of the biggest particle, - second letter : type of silicon - the last number : phase change temperature |
2.0 | 1.8 ~ 2.5 |
· Suitable replacement fot thermal grease in most cases · Thermally conductive phase changing material · Various forms of fillers and reinforcement · Low volatility etc... |
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| 2 | PCM-400-Series | 4.0 | 2.5 ~ 2.8 | ||||||
[ Product characteristics ]
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